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Metal Bond Dicing Blade

Ultra thin dicing blades are widely used in semiconducto industry,

Product category

Metal bond

Application

Semiconductor&Photoelectricity

Essential information

  • Manufacturer: Dia Abrasives
  • MOQ: 1PC
  • Packing: Box
  • Payment Terms: 1PC
  • HS Code: 6804211000/6804221000
  • Origin: China
  • Price Term: FCA, FOB, CIF, CIP, EXWORK…
  • Marking: Negotiable
  • Application
  • Features
  • Specifications
  • Competitive Advantage

1

Application

Industry Workpiece&Material Machine Bond Working Data
semiconductor industry
optical glass industry
optical communication		 BGA, LGA, LED
Blue glass, crystal, gem, filter
quartz		   Resin
Metal

Features

  • Metal bond can hold grit size strongly
  • high precision
  • good shape holding
  • good wear resistant and long using life

Specifications

Common Shape Wheel Size Grit Size Classic Specification
1A8, 1A1R OD:10-200
T:0.07-2.0
H:6, 8, 12.7, 31.75,50.8		 3um-70um

Competitive Advantage

  • R&D team update bond systems
  • Technical support in anytime
  • 10000 molds available
  • Premium Quality
  • 5-14 days delivery time
  • 20000 pcs per month capacity
  • Standard neutral and customs made package
  • Air/Express/Sea transports available
  • High QC standard, 100% inspection

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For any inquire, quality feedback or technical question, there always be a professional responding answered by our technician team within 24 hours.