Metal Bond Back Thinning Wheels

The back thinning is performed by a wet grind process with a rust inhibitor for cooling the chips and keeping the grind wheel free of debris. The grinding wheel acts a very important role in the grinding process, a low quality grinding wheel will lead high reject rate.

Product category

Metal bond

Essential information

  • Manufacturer: Dia Abrasives
  • MOQ: 1PC
  • Packing: Box
  • Payment Terms: 1PC
  • HS Code: 6804211000/6804221000
  • Origin: China
  • Price Term: FCA, FOB, CIF, CIP, EXWORK…
  • Marking: Negotiable
  • Application
  • Features
  • Specifications
  • Competitive Advantage

1

Application

Industry Workpiece&Material Machine Bond Working Data
Semiconductor industry Sapphire, silicon wafer SHUWA, NTS, WEC, GALAXY. SPEEDFAM
DISCO, OKAMOTOI, TSK, G&N, STRASBAUGH, LAMPMASTER
Vitrified
Metal

Features

  • Good surface quality
  • High efficiency
  • No scratch
  • No chipping
  • Long using life

Specifications

Common Shape Wheel Size Grit Size Classic Specification
6A2, 6A2T, 1A1 OD: 175,195,209,305,255,355 Coarse Grit: 270–800
Finish Grit: 2000–8000
6A2 175D 30T 76H
6A2 200D 35T 76H
6A2T 280D 30T 228.6H
1A1 40D 5T 18.7H

Competitive Advantage

  • R&D team update bond systems
  • Technical support in anytime
  • 10000 molds available
  • Premium Quality
  • 5-14 days delivery time
  • 20000 pcs per month capacity
  • Standard neutral and customs made package
  • Air/Express/Sea transports available
  • High QC standard, 100% inspection

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Diamond wheel in vitrified Bond offers excellent performance in bruting of Natural diamonds.

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